JPH0220708B2 - - Google Patents
Info
- Publication number
- JPH0220708B2 JPH0220708B2 JP1102984A JP1102984A JPH0220708B2 JP H0220708 B2 JPH0220708 B2 JP H0220708B2 JP 1102984 A JP1102984 A JP 1102984A JP 1102984 A JP1102984 A JP 1102984A JP H0220708 B2 JPH0220708 B2 JP H0220708B2
- Authority
- JP
- Japan
- Prior art keywords
- aqueous solution
- plating
- acid
- polyamide resin
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1102984A JPS60155681A (ja) | 1984-01-26 | 1984-01-26 | ポリアミド樹脂の無電解メツキ用触媒付与方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1102984A JPS60155681A (ja) | 1984-01-26 | 1984-01-26 | ポリアミド樹脂の無電解メツキ用触媒付与方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60155681A JPS60155681A (ja) | 1985-08-15 |
JPH0220708B2 true JPH0220708B2 (en]) | 1990-05-10 |
Family
ID=11766658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1102984A Granted JPS60155681A (ja) | 1984-01-26 | 1984-01-26 | ポリアミド樹脂の無電解メツキ用触媒付与方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60155681A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0614415U (ja) * | 1992-06-04 | 1994-02-25 | 日産ディーゼル工業株式会社 | 内燃機関の潤滑油冷却装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178956A (en) * | 1989-10-03 | 1993-01-12 | Shipley Company Inc. | Pretreatment process for electroless plating of polyimides |
US5279899A (en) * | 1992-03-17 | 1994-01-18 | Monsanto Company | Sulfonated polyamides |
JPWO2014017291A1 (ja) * | 2012-07-26 | 2016-07-07 | 学校法人関東学院 | シリコーン樹脂の導電化方法及び金属皮膜付シリコーン樹脂 |
-
1984
- 1984-01-26 JP JP1102984A patent/JPS60155681A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0614415U (ja) * | 1992-06-04 | 1994-02-25 | 日産ディーゼル工業株式会社 | 内燃機関の潤滑油冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS60155681A (ja) | 1985-08-15 |
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